Sepha is set to showcase its latest PakScan model for non-destructive testing of flexible and semi-rigid packaging at PACK EXPO International 2026, expanding its packaging integrity inspection capabilities with configurable test layouts, low-headspace testing and a smaller footprint.
The system will be demonstrated at McCormick Place in Chicago from October 18–21, 2026, at Booth W-24060. PACK EXPO International 2026 is scheduled to bring more than 2,700 exhibitors to the event.
Configurable NDT for Multiple Packaging Formats
The redesigned PakScan features a configurable test area that supports 1-, 2-, 3- or 6-pack testing. Individual load cells can be activated or deactivated depending on the packaging format, allowing the testing arrangement to be adjusted to different pack sizes.
Each active position produces an individual pass/fail result, providing objective testing outcomes for packaging integrity assessment.
The system also provides deeper vacuum capability for low-headspace packs, while its smaller overall footprint is intended to support installation in laboratory, production and quality-control environments.
Force Decay Technology Supports Non-Destructive Inspection
PakScan uses deterministic Force Decay technology to detect pinholes, weak seals, channel leaks and gross defects in sealed, non-porous flexible and semi-rigid packaging.
The non-destructive testing approach provides objective and repeatable results without destroying packs that pass inspection. Supported packaging formats include pouches, sachets, stick packs, pillow packs, doy packs, laminate pouches, transdermal patch packs and semi-rigid trays or cups with non-porous lidding.
Force Decay testing measures the force generated by a flexible package under vacuum. Changes in the measured force can indicate whether a package has a gross leak, micron leak or no leak.
Shared Data Supports Consistent Inspection
Multiple PakScan systems can be connected to a shared database, allowing manufacturers to use the same validated test method across multiple machines.
The shared database capability is intended to support consistent seal-integrity testing in higher-throughput environments while providing access to test, recipe and batch data.
From an NDT perspective, the system combines non-destructive leak detection with objective pass/fail results, enabling packaging manufacturers to assess integrity while retaining packs that successfully pass the inspection.
Sepha Highlights Flexibility in Packaging Inspection
“The growing variety of flexible packaging formats makes adaptability increasingly important,” said Claire Miskelly, Head of Sales at Sepha. “The latest PakScan gives manufacturers the flexibility to configure the system around different formats, sizes and headspace levels while continuing to deliver objective, repeatable results.”
At PACK EXPO International 2026, visitors to Booth W-24060 will be able to see the PakScan testing process and discuss application requirements with Sepha specialists. The company will also display the VisionScan 3D, Multi-Q, EZ Blister+ and PressOut Universal Mini at the event.
