Nikon Corporation has announced a comprehensive set of software and hardware enhancements to its XT V Series X-ray and computed tomography (CT) inspection systems, reinforcing their position as a high-performance solution for non-destructive testing (NDT) in electronics manufacturing and semiconductor inspection.
The latest upgrades are designed to improve image quality, expand scanning capacity for heavier and more complex components, and protect radiation- and electrostatic-sensitive electronics during inspection. Available as optional enhancements, the additions allow manufacturers to tailor the XT V Series to specific inspection requirements while maintaining a fully non-destructive workflow.
A key software update, High Contrast Filter 2.0, delivers consistently clear radiographic images across varying sample shapes and densities, ensuring defects are immediately visible without manual image adjustments. This enhancement supports faster interpretation and higher inspection confidence in demanding production environments.
On the hardware front, Nikon has introduced five major upgrades. The Heavy Duty Tray enables inspection of larger and heavier parts, increasing batch capacity and expanding application scope. The Diamond Window improves image contrast across the operating range, particularly for low-density and mixed-material samples, while also reducing noise and accelerating inspection cycles.
For sensitive electronic components, the Low-Dose Collimator minimises radiation exposure, making it suitable for semiconductor devices and high-density electronics. The ESD Safety Upgrade enables inspection of electrostatic-sensitive components in compliance with IEC, ANSI and JEDEC standards when used within an ESD-Protected Area. In addition, the High Magnification CT Arm allows higher-resolution CT scans of small samples, revealing finer structural details critical for advanced failure analysis.
These enhancements address the growing complexity of modern electronics, where non-destructive inspection must detect defects in BGAs, bond wires and multilayer semiconductor packages without compromising component integrity. The XT V Series is further supported by Nikon’s PCB Analysis Suite, which provides automated measurement, pass/fail evaluation and reporting for consistent and repeatable quality control.
Operational efficiency remains central to the XT V platform. Using Nikon’s Inspect-X interface, operators can configure automated inspection routines quickly, while collision-avoidance features and intelligent motion control protect both samples and systems during high-magnification scans. Nikon’s Xi microfocus X-ray sources and open-tube design continue to deliver stable, high-brightness imaging with low maintenance requirements.
With the latest upgrades, the XT V Series strengthens its role as a versatile, non-destructive inspection solution for electronics manufacturing, semiconductor production and advanced quality assurance, offering enhanced clarity, flexibility and protection in increasingly demanding inspection environments.
Reference: https://metrology.news/nikon-enhances-xt-v-for-advanced-ct-inspection/
