Teradyne, Inc., a global leader in automated test solutions and advanced robotics, has announced the launch of its Titan HP system level test (SLT) platform, developed to meet the growing demands of artificial intelligence (AI) and cloud infrastructure markets. The platform is designed to address the increasing complexity of semiconductor devices as process nodes continue to shrink and new architectures emerge.
As advanced devices for AI and data center applications push the limits of power density and thermal performance, SLT has become an essential step in ensuring quality and reliability in high-volume manufacturing. Teradyne Titan HP, now in production across several major customer sites, is engineered to test these high-performance devices under real-world operating conditions.
The system currently supports up to two kilowatts of power, with a clear roadmap to scale to four kilowatts, positioning it to meet the rigorous needs of next-generation computing components.
“Teradyne Titan HP represents a significant advancement in testing the leading-edge devices powering today’s AI and cloud infrastructure,” said Jason Zee, Vice President and General Manager of the Integrated Systems Test division at Teradyne. “Our commitment to innovation in thermal control and power delivery capabilities, coupled with our world-class support organization, ensure that our customers can achieve the highest quality standards required for their next-generation devices.”
Superior Thermal and Power Management
The Titan HP platform incorporates several engineering innovations designed to improve the accuracy, repeatability, and safety of high-power device testing. Its multi-branch cold plate architecture enables simultaneous cooling of both the device under test (DUT) and surrounding components, ensuring thermal stability across all sites.
Additionally, its asynchronous cooling control, tuned with proportional, integral, and derivative (PID) algorithms, offers per-site temperature management, minimizing the risk of overheating while improving energy efficiency.
A DUT heater option further enhances automated temperature control (ATC) precision, enabling operators to simulate and validate performance across a wide range of thermal conditions.
These capabilities ensure devices consistently meet or exceed required quality and reliability standards, even under demanding test scenarios.
Future-Ready System-Level Testing
As part of Teradyne’s broader portfolio of high-performance test and measurement solutions, Titan HP enables mission-mode testing for AI and cloud infrastructure devices, bridging the gap between component testing and full system validation.
This new platform reinforces Teradyne’s position as a global leader in system-level test solutions, helping manufacturers future-proof their capital equipment investments and maintain competitiveness in rapidly evolving technology markets.
Reference: https://www.businesswire.com/news/home/20251002549708/en/Teradyne-Unveils-Titan-HP
