Company to highlight X-ray inspection and metrology technologies for advanced logic, HBM and advanced semiconductor packaging
The Rigaku Group is set to showcase its latest X-ray metrology and inspection technologies at SEMICON Taiwan 2026, taking place from September 2 to 4 at TaiNEX 1 and 2 in Taipei, Taiwan.
The exhibition comes as semiconductor manufacturing continues to advance toward increasingly complex architectures involving advanced logic, high-bandwidth memory (HBM) and advanced packaging. Rigaku’s portfolio is designed to support applications ranging from research and development to high-volume manufacturing, with a focus on process control, materials characterization and nondestructive analysis.
Taiwan remains a key center of the global semiconductor industry, particularly in advanced logic, HBM and packaging technologies. Rigaku has been strengthening its regional presence following the opening of the Rigaku Technology Center Taiwan (RTC-TW) in 2025.
At SEMICON Taiwan 2026, the company will demonstrate X-ray-based technologies aimed at inspecting internal structures and measuring material and dimensional characteristics that can be difficult to evaluate using conventional optical inspection methods.
X-ray Inspection for Advanced 2.5D and 3D Packaging
One of the key systems being showcased is the XHENA AX-3000, an advanced X-ray inspection platform designed for 2.5D and 3D semiconductor packaging.
The system combines 3D laminography with automated defect identification to inspect hidden structures within advanced packages. Its capabilities include high-resolution, sub-micron detection of defects involving micro-bumps and through-silicon vias (TSVs), with applications in chip-on-wafer-on-substrate (CoWoS), HBM and hybrid bonding.
The XHENA AX-3000 is currently available for customer evaluation, providing semiconductor manufacturers with an opportunity to assess its inspection capabilities for advanced packaging applications.
As semiconductor packages become more densely integrated, the ability to nondestructively inspect internal structures is becoming increasingly important for identifying defects without damaging valuable devices.
Panel-Level Packaging Process Control
Rigaku will also introduce the XHEMIS WX-PLP310, an X-ray analyzer designed for process control in panel-level packaging (PLP).
The system measures material composition and thin-film thickness across large substrates. This capability is intended to support process monitoring as semiconductor packaging moves toward larger panel formats.
Unlike conventional wafer-based manufacturing, panel-level packaging uses large rectangular substrates, potentially allowing more devices to be processed during each production cycle. The shift creates new requirements for accurate and consistent measurement across larger areas.
The XHEMIS WX-PLP310 is also available for customer evaluation.
XTRAIA Platform Targets Thin-Film and Advanced Structure Metrology
Rigaku will further highlight its XTRAIA MF Series of X-ray metrology systems.
The portfolio includes the XTRAIA MF-3400, described as the company’s fourth-generation multifunctional X-ray metrology platform for high-throughput thin-film analysis.
The company will also showcase the XTRAIA XD-3300, which is designed for high-precision measurement of advanced structures on ultra-small wafer pads.
Together, the systems address measurement requirements associated with increasingly miniaturized semiconductor structures, where process control and dimensional accuracy are critical to manufacturing performance.
ONYX Series Combines X-ray and Optical Technologies
Rigaku’s ONYX Series will also be featured at the exhibition. The systems are designed for applications spanning advanced packaging, HBM, hybrid bonding and back-end-of-line (BEOL) process control.
The series combines X-ray and optical technologies to provide rapid, nondestructive characterization of complex multilayer semiconductor structures.
The combination of complementary inspection and metrology methods is intended to provide manufacturers with greater visibility into structures that may be difficult to characterize using a single inspection technique.
Supporting Semiconductor NDT and Process Control
The technologies being presented at SEMICON Taiwan 2026 reflect the growing role of X-ray-based nondestructive inspection and metrology in advanced semiconductor manufacturing.
As packaging architectures become more complex, conventional surface inspection can be insufficient for identifying defects within multilayer structures, interconnects and other hidden features. X-ray technologies can provide access to internal information without requiring destructive analysis of the device.
Rigaku’s solutions are therefore positioned across several stages of semiconductor development and production, from materials characterization and research through process control and high-volume manufacturing.
The company will also highlight its strategic alliance with Onto Innovation, which combines X-ray and optical technologies to advance hybrid metrology solutions for semiconductor manufacturing.
Rigaku to Meet Industry Visitors at SEMICON Taiwan
Rigaku specialists will be available at the company’s booth during SEMICON Taiwan 2026 to discuss semiconductor metrology, process control and analysis requirements with visitors.
The exhibition will be held from September 2 to 4 at TaiNEX 1 and 2 in Taipei. Rigaku will exhibit at Booth N0592.
The company is also marking its 75th anniversary in 2026. Its exhibition booth will feature Dr. Rixsee, a brand mascot created by Rigaku employees to commemorate the milestone. Visitors will also be able to receive a Rigaku 75th Anniversary Journal while supplies last.
For the NDT and semiconductor manufacturing sectors, Rigaku’s presence at SEMICON Taiwan 2026 highlights the expanding application of X-ray inspection and metrology for advanced packaging, HBM and other high-density semiconductor technologies.
