Innometry has announced a joint research collaboration with University College London (UCL) to develop microcrack detection technology for glass substrates after being selected for South Korea's 2026 Global Cooperation R&D Program, sponsored by the Ministry of SMEs and Startups.
The three-year project, which will run through June 2029, aims to develop a high-resolution X-ray inspection system capable of precisely detecting microcracks generated during the through-glass via (TGV) manufacturing process. The proposed system is designed to identify defects that are difficult to detect using conventional X-ray absorption imaging by employing next-generation high-resolution imaging techniques.
Under the project, Innometry will serve as the lead research organization, while UCL will participate as the joint research partner.
The collaboration builds on Innometry's earlier selection in March for a separate government-funded research program led by South Korea's Ministry of Trade, Industry and Resources. That initiative focuses on the development of artificial intelligence (AI)-based X-ray and computed tomography (CT) inspection systems for glass substrate TGV applications.
The Global Cooperation R&D Program is intended to support South Korean small and medium-sized enterprises by facilitating joint research with leading international institutions, strengthening technological competitiveness, and supporting expansion into global markets.
From a non-destructive testing (NDT) perspective, the project focuses on advancing X-ray inspection capabilities for glass substrate manufacturing, where detecting microcracks is critical for ensuring component quality in advanced semiconductor packaging processes.
Innometry currently supplies inspection equipment to major global battery cell manufacturers, including South Korea's three leading battery producers. The company is also expanding the application of its NDT and AI-based image analysis technologies into advanced manufacturing areas such as glass substrate TGVs, advanced semiconductor packaging, and co-packaged optics (CPO).
The company has also supplied inspection systems to several TGV-related companies, including JWMT, XTOL, and Anycasting, further expanding its presence in inspection solutions for advanced electronics manufacturing.
Reference: https://www.thelec.net/news/articleView.html?idxno=12394
