TeraView has demonstrated the effectiveness of its terahertz-based non-destructive testing (NDT) system for advanced semiconductor inspection through joint research with AMD, highlighting the growing role of NDT in next-generation electronics manufacturing.
The company’s EOTPR (Electro-Optical Terahertz Pulse Reflectometry) system utilizes terahertz waves to inspect internal semiconductor interfaces without damaging the device. The technology enables precise detection and analysis of defects within complex chip architectures, particularly in advanced packaging environments.
The findings were presented in a joint paper at the International Symposium for Testing and Failure Analysis held in California, where the system was validated for its ability to isolate and analyze defects in D2D interconnect traces between AI chiplet devices.
The development comes amid increasing demand for non-destructive inspection solutions in semiconductor manufacturing, as the industry shifts toward system-in-package (SiP) and heterogeneous integration to overcome scaling limitations. These architectures, widely used in AI, high-performance computing, and data center applications, introduce higher structural complexity and require advanced inspection capabilities to ensure reliability.
Since the publication of the research, TeraView has reported increased interest from both existing and prospective customers, particularly as semiconductor manufacturers seek solutions to improve yield and reduce production costs in high-performance chip production.
“EOTPR is essential for improving yield, reducing production costs, and ensuring quality reliability for high-end advanced semiconductors,” a Terraview official stated. "We expect to expand our customer base to include not only HBM manufacturers but also global foundries."
The company is also in discussions regarding supply agreements with major semiconductor manufacturers, with system upgrades for AI chip inspection already scheduled at a global foundry.
Donald Dominic Arnon highlighted the broader application potential of the technology across semiconductor platforms.
“We are working closely with major global semiconductor companies such as NVIDIA and AMD, and EOTPR is a solution capable of inspecting key components across not only GPUs but also AI chips,” adding, “We will continue to advance our technology and expand our customer base so that it can establish itself as a standard inspection method throughout the global semiconductor supply chain.”
The development underscores the increasing importance of advanced NDT techniques in semiconductor manufacturing, particularly as chip architectures evolve to meet the demands of AI-driven applications and high-performance computing environments.
Reference: https://www.venturesquare.net/en/1073673/
