QuantumDiamonds GmbH has announced the successful deployment of its QDm.1 system at Integrated Service Technology (iST) in Hsinchu, Taiwan. The installation marks the company’s first deployment in Asia and highlights the growing adoption of quantum sensing technologies in semiconductor failure analysis.
The Munich-based company’s expansion into Asia follows earlier installations in the United States, positioning the latest deployment as a milestone in scaling non-destructive testing (NDT) solutions for high-volume semiconductor environments. The system is now operational at iST’s facility in Hsinchu, a key centre for advanced chip manufacturing and testing.
QuantumDiamonds’ QDm.1 system is based on Quantum Diamond Microscopy (QDM) technology and enables non-destructive, high-resolution three-dimensional imaging of current pathways in complex semiconductor architectures. The system is designed to support analysis of advanced packaging formats such as 2.5D and 3D structures, backside power networks, and materials including GaN and SiC.
The deployment comes amid increasing demand for efficient failure analysis solutions as semiconductor manufacturers face challenges related to yield loss and rising chip complexity. The system provides manufacturers with detailed insights to identify failures and optimise production processes.
Commenting on the development, Peter Lemmens, Managing Director APAC at QuantumDiamonds, said:
"Completing our first Asia installation at iST is a defining moment for QuantumDiamonds. Hsinchu is home to some of the most sophisticated chip manufacturing and testing operations in the world. Being embedded here, in partnership with a laboratory of iST’s caliber, gives us an outstanding platform to demonstrate what quantum sensing can deliver – and to build from."
Kevin Berghoff, CEO of QuantumDiamonds, added:
"Taiwan is the epicenter of advanced semiconductor manufacturing, and iST is one of the most respected failure analysis laboratories in the region. This installation is more than a commercial milestone – it is validation that quantum sensing is ready for the most demanding real-world environments in the industry. We are proud to partner with iST and look forward to supporting their customers with a capability that simply did not exist before."
Sean Shen, Director of Failure Analysis Engineering Division at iST, said:
"Our customers are working at the leading edge of chip complexity, and they need failure analysis tools that can keep pace. The QDm.1 gives our engineers a fundamentally new way to interrogate advanced devices – non-destructively, in three dimensions, and at a speed that fits our workflow. We see significant potential for this technology across the range of advanced packaging and high-density interconnect challenges our customers face."
The deployment underscores the increasing role of advanced NDT techniques in semiconductor inspection, particularly as the industry moves toward more complex device architectures and higher production volumes.
