Automatic void analysis in complex electronic components

Automatic void analysis in complex electronic components

Join our webinar "Automatic void analysis in complex electronic components" on September 29th, 2021

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Join our webinar "Automatic void analysis in complex electronic components" on September 29th, 2021. In this webinar, Peter Koch will demonstrate

- how various programs work hand in hand

- how easily laminography sequences can get integrated into inspection programs, and

- how effective the automatic void analysis with VoidInspect supports the production of electronic components such as #BGA, #LGA, #IGBT, #QFN, etc.

Register today: https://lnkd.in/dib69Bwf 

Registration will be open until September 26th, 2021.