Introducing Teledyne FLIR's Latest Game-Changer: Meet Lepton 3.1R, Your Radiometric Thermal Camera Module!

Teledyne FLIR, a prominent arm of Teledyne Technologies Incorporated, has ignited excitement with the launch of its groundbreaking creation, Lepton 3.1R. This innovative masterpiece boasts the distinction of being the world's inaugural radiometric thermal camera module to feature an expansive 95-degree field of view (FOV), 160 x 120 resolution, and an impressive scene dynamic range of up to 400 degrees Celsius.

The Lepton 3.1R doesn't just deliver extraordinary capabilities; it maintains the coveted compact and low-power form factor that has solidified the Lepton family of thermal camera modules as a global sensation. Known for powering mobile devices, small electronics, and uncrewed systems, this lineage has secured its reputation as the world's best-selling thermal camera module series.

Mike Walters, Vice President of Product Management at Teledyne FLIR, highlighted the revolutionary impact of the Lepton family. "The revolutionary Lepton was the world's first thermal micro camera module integrated into millions of devices from ruggedized smartphones to drones," Walters stated. "Lepton 3.1R can now propel advancements in cost-saving and lifesaving unattended products ranging from early fire monitoring of critical machinery, electrical switchgear, and data centers to IoT products for smart factories, occupancy monitoring, smart homes, smart appliances, and even elderly care applications."

The Lepton 3.1R seamlessly integrates into existing Lepton-based products, offering a hassle-free enhancement. It preserves the familiar visual object and space perception interface (VoSPI), inter-integrated circuit (I2C), electrical, and mechanical form and fit, simplifying the development process. Additionally, the Lepton family remains unmatched in terms of affordability, making it the most cost-effective focal plane array (FPA) based thermal sensor available.

With its superior thermal sensitivity of <50 mK, Lepton stands as a testament to uncooled micro thermal camera innovation. A host of proprietary technologies, including wafer-level detector packaging, wafer-scale micro-optics, custom application-specific integrated circuits (ASICs), and an easily-integrable camera package, sets Lepton apart. Moreover, the Lepton family's prowess includes integrated digital thermal image processing and radiometry, enabling precise temperature measurement for every pixel in the scene.

For integrators and developers looking to optimize their development journey, Teledyne FLIR offers a comprehensive Lepton integration toolbox. This online resource provides application notes and source code for testing on various platforms such as Windows, Linux, Raspberry Pi, and BeagleBone. Additionally, the Teledyne FLIR Technical Services team stands ready to assist customers in licensing MyFLIR® application software, as well as image-enhancing multispectral dynamic imaging (MSX®) and Vivid-IR™ technologies. This support ensures reduced technical risk and maximized performance, underscoring Teledyne FLIR's commitment to driving excellence in thermal imaging solutions.