Muanalysis
MuAnalysis Inc is a privately owned professional laboratory and analytical service provider located in Ottawa.
Service
Canada
Overview
MuAnalysis Inc is a privately owned professional laboratory and analytical service provider located in Ottawa.
The company was founded in 2002 by Dr. Martine Simard-Normandin, formerly a scientist with Nortel Networks and later with STMicroelectonics. MuAnalysis provides analytical expertise and solutions to the electronics, photonics, life sciences, and manufacturing industries. Our customers benefit from our decades of collective experience in microanalysis and process analysis. MuAnalysis offers expertise in electron microscopy, optical microscopy, materials and failure analysis techniques and reliability testing to its customers. Our specialized equipment and range of scientific skills have enabled MuAnalysis to continue to capture significant global market share.
Products & Services
Failure Analysis
Our vast inventory of lab equipment and scientific techniques enables us to verify device parameters, identify fault locations, determine failure modes and root-cause of failures in printed circuit boards, discrete components in a wide range of technologies.
By classifying Failure Analysis in three broad categories by degree of complexity, this allows us to detect failures as quickly and efficiently as possible. The results of each level of analysis are recorded in an appropriate report.
Level 1
We quickly pinpoint the defect using non-invasive microscopy techniques.
Scanning Acoustic Microscopy (C-SAM)
Decapsulation and package opening
Visual inspection including optical microscopy and Laser Scanning Microscopy (LSM)
Level 2
When the defect is hidden, we localize it by using more advanced techniques to actually reproduce the failure in the lab.
Liquid crystal fault isolation
Optical Beam Induced Current (OBIC)
Level 3
We determine root-cause by open-ended analysis, to gain understanding of the nature of the failure and its relationship to observed faults or defects. MuAnalysis undertakes each step in this Level 3 analysis only with approval of our customer.
Various optical techniques for fault isolation
Delayering or cross-sectioning
Scanning Electron Microscopy (SEM)
Microprobing, with pico probes BGA layer-by-layer construction analysis
Ads
